Bis(4-hydroxyphenyl) Sulfone is commonly used as a reactant in epoxy reactions and is also used as a latent thermal catalyst for epoxy resin. Melting Point: 245-249C Solubility: DMSO, Methanol
Molecular Weight:
250.27
Form:
Supplied as a White Solid
CAS Number:
[80-09-1]
* VAT and and shipping costs not included. Errors and price changes excepted