2,4-Dihydroxydiphenylmethane can be used in anisotropically conductive paste containing thermosetting compd. and solder particles with improved reliability. Molecular Formula: C13H12O2 Molecular Weight: 200.23 Storage and Stability: Store at -20C. For maximum recovery of product, centrifuge the original vial prior to removing the cap.
Molecular Weight:
200.23
CAS Number:
[2467-03-0]
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